C-TECH晶振解答你關(guān)于SAW濾波器的十萬個(gè)為什么

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瀏覽：- 發(fā)布日期：2023-10-19 16:04:09【大中小】

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C-TECH是一家領(lǐng)先的制造和開發(fā)公司，自1997年成立以來，主要研發(fā)生產(chǎn)銷售SAW濾波器業(yè)務(wù)，至今已超過20年。C-TECH采用優(yōu)異的原料，先進(jìn)的技術(shù)設(shè)備生產(chǎn)，產(chǎn)品品質(zhì)和經(jīng)驗(yàn)絲毫不輸同行。C-TECH晶振正在開發(fā)一種半導(dǎo)體工藝，可以獨(dú)立完成制造和組裝。憑借積累的技術(shù)和知識，我們提供定制開發(fā)根據(jù)客戶要求的規(guī)格。

基于ISO 9001和ISO 14001的可靠性，聲表面波濾波器開發(fā)和生產(chǎn)本身就是生產(chǎn)CDMA / LTE / 5G移動中繼、國防工業(yè)、基站、收音機(jī)、無線尋呼機(jī)、無線麥克風(fēng)、調(diào)頻、DMB、GPS、WiFi、高通、藍(lán)牙、IOT等正在被應(yīng)用到無線業(yè)務(wù)的各個(gè)領(lǐng)域。下面C-TECH對自己精心鉆研的產(chǎn)品SAW FILTER聲表面濾波器進(jìn)行詳細(xì)介紹。

聲表面波濾波器（表面聲波）是使用表面聲波控制信號頻率分量和相位分量，以消除相鄰信道信號，它是一個(gè)帶通濾波器（BPF），對接收信道信號進(jìn)行整形。

SAW濾波器的工作原理

當(dāng)梳狀電極(IDT)形成在壓電基板的兩側(cè)并且電信號施加到輸入端時(shí)，沿襯底表面?zhèn)鞑サ谋砻媛暡?SAW)由壓電效應(yīng)產(chǎn)生，并在輸出端轉(zhuǎn)換回電信號。這些SAW器件的頻率特性由IDT電極的幾何結(jié)構(gòu)決定。

SAW濾波器制造工藝

Process	Equipment	Description
WAFER Cleaning	Wet Station Rinse & Drier	Process to remove foreign substances causing short circuit defects on the wafer surface before AI deposition and to increase adhesion between the wafer surface and AL
Sputtering	Sputter T/Profiler	Process for depositing AL on wafer surface to desired height
P.R Coating	Coater	Process for applying photo Resist on AL
Exposing	Aligner Stepper	First step process of pattern formation by irradiating UV on PR through MASK
Developing	Developer Scope	Process of removing UV irradiated PR for AL Etching after Exposing
Etching	Wet Station Rinse & Drier	Process of implementing the final pattern by removing the AL in each selected manner
Stripping	Wet Station Rinse & Drier	Process for removing PR that protects AL patterns
Auto Probing	Auto Prober Dry Oven	Process for determining good and bad products by measuring metod before puttiong the products divided into cells of the wafer into assembly

Assembl

Process	Equipment	Description
Absorber Coating	Screen Printer Dry Oven	Process of applying an absorber to each cell to improve the characteristics of the output to the measuring device
Dicing	Tape Mounter Dicing SAW Cleaner	Process of cutting each cell of the wafer based on the Dicing Line
Die Bonding	Die bonder Epoxy Dispenser UV,Dry Oven	Process of bonding base and chip by applying epoxy
Wire Bonding	Wire Bonder	The Process of connecting the terminal of the BASE and the PAD of the CHIP to transmit an electrical signal to the AL wire
Can Sealing	Spot Welder Seam Sealer Dry Oven	Welding Process using Lid & Cap to protect the chip
Marking	Laser Maker	Process of laser marking the product’s unique model name and data code
Testing	Network Analyzer	Process for final inspection of product defects
Q.C	Network Analyzer	Process of sampling and inspection of mixed or defective products
Packing	Tape & Reel	Q.C process for packaging completed products
Shipping		Shipment of all process and packaged products