SAW振蕩器,AXPS10晶振,進口SMD晶振,德國進口晶振,石英晶振,AXTAL晶振
AXTAL晶振中的AXPS10晶振,為SAW振蕩器,也叫聲表面波振蕩器,適用于汽車門遙控開關,內部捕捉系統(tǒng),數據鏈接,胎壓監(jiān)控系統(tǒng),無線安全系統(tǒng),無線條碼的讀取,無線鍵盤,無線鼠標,無線操縱桿,遙控燈開關等。該晶振的尺寸是20.3x13.0x5.7mm,頻率范圍為500~1600MHz,工作溫度范圍是-40~85度,為石英晶振,進口SMD晶振。聲表面波振蕩器具有低損耗,低耗能,低功耗,低差損,低電壓,低抖動,低電平,低電源電壓,低衰減,低相控,低相噪的特點。
SAW振蕩器,AXPS10晶振,進口SMD晶振,德國進口晶振,石英晶振,AXTAL晶振
Parameter | min. | typ. | max. | Unit | Condition | |||||||||||
Frequency Range | 500 | 1600 | MHz | |||||||||||||
Standard frequencies | 1030 / 1090 / 1532 | MHz | ||||||||||||||
Frequency stability | ||||||||||||||||
Overall tolerance (Note 2) | ±350 | ppm | ||||||||||||||
Long term (aging) per year | ±5 | ppm | ||||||||||||||
RF output | ||||||||||||||||
Signal waveform | Sine wave | |||||||||||||||
LoadRL | 50 | ? | ||||||||||||||
Output level | +7 | +10 | dBm | |||||||||||||
Harmonics | -40 | -30 | dBc | |||||||||||||
Phase noise | Please consult factory | |||||||||||||||
Supply voltage VS(Note 3) | 4.75 | 5.0 | 5.25 | V | ||||||||||||
Current consumption | 35 | 50 | mA | |||||||||||||
Operating temperature range | -40 | +85 | °C | |||||||||||||
Enclosure (see drawing) (LxWxH) | 20.3x13.0x5.7max. | mm |
Similar to
IEC 61837 CO 30
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Weight | 3 | g | ||||||||||||||
Packing | Tape & Reel | IEC 60286-3 |
Parameter | min. | max. | Unit | Condition | ||||||||||||
Supply Voltage VS | -0.5 | VS+ 10% | V | VSto GND | ||||||||||||
Storage Temperature | -55 | +105 | °C |
Parameter | Procedure | Source | ||||||||||||||
Handling and Testing | Application Note AXAN-011 | www.axtal.com | ||||||||||||||
Processing | Application Note AXAN-012 | www.axtal.com | ||||||||||||||
Parameter | Procedure | Condition | ||||||||||||||
Electrostatic discharge (ESD) | ||||||||||||||||
THD devices | IEC60749-26 | HBM | 2000 V | |||||||||||||
SMD devices | IEC60749-27 | MM | 200 V | |||||||||||||
Washable | 口Yes×No | |||||||||||||||
RoHS compliant | ×Yes口No | |||||||||||||||
Environmental conditions | ||||||||||||||||
Test |
IEC 60068 Part … |
IEC 60679-1 Clause |
MIL-STD- 202G Method |
MIL-STD- 810F Method |
MIL-PRF- 55310D Clause |
Test conditions (IEC) | ||||||||||
Sealing tests (if applicable) |
2-17 | 5.6.2 | 112E | 3.6.1.2 |
Gross leak: Test Qc, Fine leak: Test Qk |
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Solderability Resistance to soldering heat |
2-20 2-58 |
5.6.3 |
208H 210F |
3.6.52 3.6.48 |
Test Ta Method 1 Test Td1Method 2 Test Td2Method 2 |
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Shock* | 2-27 | 5.6.8 | 213B | 516.4 | 3.6.40 |
Test Ea, 3 xper axes 100g, 6 ms half-sine pulse |
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Vibration, sinusoidal* |
2-6 | 5.6.7.1 |
201A 204D |
516.4-4 |
3.6.38.1 3.6.38.2 |
Test Fc, 30 min per axes, 10 Hz - 55 Hz 0,75mm; 55 Hz - 2 kHz, 10g |
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Vibration, random* |
2-64 | 5.6.7.3 | 214A | 514.5 |
3.6.38.3 3.6.38.4 |
Test Fdb | ||||||||||
Endurance tests - ageing - extended aging |
5.7.1 5.7.2 |
108A | 4.8.35 |
30 days @ 85°C, OCXO @25°C 1000h, 2000h, 8000h @85°C |
SAW振蕩器,AXPS10晶振,進口SMD晶振,德國進口晶振,石英晶振,AXTAL晶振
SAW振蕩器,AXPS10晶振,進口SMD晶振,德國進口晶振,石英晶振,AXTAL晶振
1、抗沖擊
晶體產品可能會在某些條件下受到損壞。例如從桌上跌落或在貼裝過程中受到沖擊。如果產品已受過沖擊請勿使用。
2、輻射
暴露于輻射環(huán)境會導致產品性能受到損害,因此應避免照射。
3、化學制劑 / pH值環(huán)境
請勿在PH值范圍可能導致腐蝕或溶解產品或包裝材料的環(huán)境下使用或儲藏這些產品。
4、粘合劑
請勿使用可能導致產品所用的封裝材料,終端,組件,玻璃材料以及氣相沉積材料等受到腐蝕的膠粘劑。 (比如,氯基膠粘劑可能腐蝕一個晶體單元的金屬“蓋”,從而破壞密封質量,降低性能。)
5、鹵化合物
請勿在鹵素氣體環(huán)境下使用產品。即使少量的鹵素氣體,比如在空氣中的氯氣內或封裝所用金屬部件內,都可能產生腐蝕。同時,請勿使用任何會釋放出鹵素氣體的樹脂。
6、靜電
過高的靜電可能會損壞產品,請注意抗靜電條件。請為容器和封裝材料選擇導電材料。在處理的時候,請使用電焊槍和無高電壓泄漏的測量電路,并進行接地操作。